内容标题30

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                产品及服务 > 软对硬真空贴合设备

                软对硬真空贴合设备

                产品应用

                · 应用于CG/LCM+film工艺中,将film贴合到CG/LCM上

                · CCD对位﹑高速﹑稳定﹑高精度

                · 自带FFU,高效,高良率

                · 先进制程、业界领先

                技术参数

                · 适用产品: 5”~10.1” 

                · 贴附精度﹕±0.075mm

                · UPH: 330pcs

                · 贴合方式:真空

                · 贴附良率:≧98% 

                · 无气泡,无偏移

                · 主体尺寸:1700MM

                     (单工位为1000MM)(W)*750MM(D)*1650MM(H )